Question 1

India is now setting up fabrication plants for the most advanced 2-nanometer chips found in modern smartphones.

Accepted Answer

The newly approved fabs and OSATs focus on mature technology nodes (28nm and above), specialty compound semiconductors (like Silicon Carbide), and advanced packaging, not cutting-edge sub-5nm logic chips.

Question 2

Silicon Carbide (SiC) is just a brand name for a standard silicon chip.

Accepted Answer

Silicon Carbide is a distinct 'compound semiconductor' made of silicon and carbon. It possesses entirely different electrical and thermal properties than pure silicon.

Question 3

Consider the following statements regarding the semiconductor manufacturing projects approved under the India Semiconductor Mission (ISM) in August 2025:
1. SiCSem is establishing India's first commercial Silicon Carbide (SiC) compound fabrication facility in Odisha.
2. The ISM funding exclusively targets the establishment of cutting-edge 2-nanometer and 3-nanometer logic foundries.
3. 3D Glass Solutions is setting up a facility in Andhra Pradesh utilizing 3D Heterogeneous Integration (3DHI) technology.
How many of the above statements are correct?

Accepted Answer

(a) Only one — Only Statement 1 is correct. SiCSem is indeed setting up India's first commercial SiC fab in Odisha. Statement 2 is incorrect because the ISM currently focuses heavily on mature nodes (28nm+), compound semiconductors, and ATMP/OSAT packaging, not exclusively sub-5nm nodes. Statement 3 is incorrect because 3D Glass Solutions is setting up its advanced packaging facility in Odisha, not Andhra Pradesh (ASIP Technologies is setting up the facility in Andhra Pradesh).

Question 4

Match the newly approved semiconductor companies (List I) with their primary technological focus or location (List II).
List I:
A. SiCSem
B. 3D Glass Solutions
C. CDIL
D. ASIP Technologies

List II:
1. Expansion of discrete semiconductor manufacturing in Punjab
2. ATMP facility established in Andhra Pradesh in partnership with a South Korean firm
3. Embedded glass substrate and 3DHI packaging in Odisha
4. India's first commercial Silicon Carbide (SiC) fab in Odisha

Accepted Answer

(a) A-4, B-3, C-1, D-2 — SiCSem is building a SiC fab in Odisha (A-4). 3D Glass Solutions is bringing embedded glass packaging to Odisha (B-3). CDIL is expanding its discrete semiconductor facility in Mohali, Punjab (C-1). ASIP Technologies is setting up an ATMP facility in Andhra Pradesh with South Korea's APACT (D-2).

Question 5

Assertion (A): Silicon Carbide (SiC) semiconductors are preferred over traditional pure silicon semiconductors for high-power applications such as electric vehicles and solar inverters.
Reason (R): Silicon Carbide possesses a wider energy bandgap and higher thermal conductivity compared to standard silicon.
Select the correct answer from the codes given below:

Accepted Answer

(a) Both A and R are true, and R is the correct explanation of A. — Both statements are correct. Pure silicon has a narrow bandgap (~1.1 eV), which limits its performance at very high voltages and temperatures. Silicon Carbide (SiC) has a wide bandgap (~3.3 eV) and superior thermal conductivity, allowing it to handle the immense power requirements of EVs and grid inverters without degrading, which is exactly why R explains A.

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